Overview

3D IC is emerging as a promising approach to extend Moore’s law, overcome pin bandwidth limitations, and improve digital platform density and cost beyond a single chip. 3D IC as a technology, however, also introduces a number of key design, methodological, implementation and technological challenges that must be overcome to make them practical and cost-effective. This workshop is a two-day forum that brings together experts from industry and academia to shed light on these near-term to long-term challenges and solutions, and covers topics including, but not limited to, applications requiring 3D, 3D processor, memory and interconnect architectures, thermal management, design methodologies and tools, and testing.



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